October 31, semi released the latest report of MEMS and sensor Fab manufacturing plant (FAB) to 2023, which said that it is expected that the total installed capacity of global MEMS and sensor Fab manufacturing plants will increase by 25% to 4.7 million wafers per month between 2018 and 2023 due to the explosive demand of communication, transportation, medical, mobile, industrial, robot, Internet of things and other applications.

Semi forecasts that in 2023, MEMS wafer manufacturing plants will account for 46% of all MEMS and sensor built-up plants. Image sensor Fabs will account for 40% of the total, while other product Fabs (which produce both MEMS and image sensors) will account for 14%.

Japan leads the world in MEMS and sensor capacity in 2018, followed by Taiwan, America and Europe / Middle East.

By 2023, China's installed capacity is expected to rise from sixth place this year to the third largest region. Unsurprisingly, Japan and Taiwan will remain in the top two places by 2023.

According to the report of MEMS and sensor fabs, from 2018 to 2023, the annual investment of Fabs' equipment hovered around 4 billion US dollars, most of which (estimated to account for 70%) was dedicated to manufacturing image sensors with the size of 300 mm wafer.

Over the same period, investment in fab equipment in Japan is expected to peak at nearly $2 billion in 2020, compared with $1.6 billion in Taiwan.

Between 2018 and 2023, 14 new Fabs will be built, mainly for MEMS and sensors on 8-12 inch wafers. China's new Fabs are the fastest growing, followed by Japan, Taiwan and Europe.

Source: and non network